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preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 1 general description the ap1686 is a high performance ac/dc power supply controller for led lighting application. the device uses pulse frequency modulation (pfm) method to build discontinuous conduction mode (dcm) flyback power supplies. the ap1686 provides accurate constant voltage, constant current (cv/cc) regulation without requiring an opto-coupler and the secondary control circuitry. it also eliminates the need of loop compensation circuitry while maintaining good stability. the ap1686 can achieve excellent regulation and high average efficiency, yet meets no-load consumption less than 30mw. it also has an adjustable built-in line compensation function to achieve tight cc. the ap1686 is available in sot-23-6 package. features ? primary side control for tight constant current and constant voltage ? 30mw no-load input power ? bipolar junction transistor (bjt) driving ? open circuit protection ? over voltage protection ? short circuit protection ? sot-23-6 package applications ? led driver figure 1. package type of ap1686 sot-23-6
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 2 pin configuration k6 package (sot-23-6) 1 2 34 5 pin 1 mark 6 figure 2. pin configuration of ap1686 (top view) pin description pin number pin name function 1 out the out pin is used to turn on and turn off the power switch. when turning on the power switch, the out pin will output 30ma source current to support the base current of the power bjt. when turning off the power switch, the resistance between the out and gnd will become to 5 2, 5 gnd the gnd pin is the ground of the ic. when the power bjt is turned off, a fast reverse sinking current to the gate of bjt will flow out from this pin. attention should be paid to in the pcb layout 3 vcc the vcc pin supplies the power for the ic. in order to get the correct operation of the ic, a capacitor with low esr should be placed as close as possible to the vcc pin 4 cs the cs is the current sense pin of the ic. the ic will turn off the power bjt according to the voltage on the cs pin. when the power bjt is on, a current is output from the cs pin which is proportional to the line voltage to realize the function of line compensation 6 fb the cv and cc regulation are realized based on the voltage sampling of this pin
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 3 functional block diagram regulator & bias ovp & ockp pfm t ons uvlo uvlo cv_ ctrl pfm driver r q s r q s cc_ctrl fb cs vcc out gnd constant voltage control constant current control tonsec detector 0.1v v fb 4 3 1 2,5 6 pro v ref1 comp ea peak current control & leb t ons pro cc_ ctrl v ref2 shutdown pre_shutdown line compensation figure 3. functional block diagram of ap1686
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 4 ordering information ap1686 - package temperature range part number marking id packing type sot-23-6 -40 to 85 c AP1686K6TR-G1 gbq tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. absolute maximum ratings (note 1) parameter symbol value unit supply voltage v cc -0.3 to 30 v cs to gnd voltage -0.3 to 7 v fb input voltage v fb -40 to 7.5 v source current at out pin ? i source ? internally limited ? a operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10 sec) t lead 300 oc thermal resistance (junction to ambient) ja 200 oc/w esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. g1: green tr: tape & reel package k6: sot-23-6 circuit type
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 5 electrical characteristics v cc =15v, t a =25c, unless otherwise specified. parameter symbol conditions min typ max unit uvlo section startup threshold v th (st) 13 15.5 18 v minimal operating voltage v opr (min) 3 3.5 4.5 v standby current section startup current i st v cc =v th (st)-1v, before startup 0 0.2 0.6 a operating current i cc (opr) static current 250 400 600 drive output section output current sink i sink apply 1v @out pin 200 300 500 ma source i source 24 30 45 ma current sense section current sense threshold voltage v cs 440 500 550 mv equivalent current sense voltage accuracy (note 2) eq vcs eq vcs , , 4 % leading edge blanking t leb the minimum power switch turn on time 300 475 720 ns feedback input section input resistance of fb pin r fb v fb =4v 1 1.6 2 m feedback threshold v fb 3.7 3.974 4.21 v line compensation section line compensation transconductance (note 2) g m 1.14 1.43 1.72 s protection section over voltage protection v fb (ovp) 6.5 7.5 8.5 v maximum on time of primary side tonp (max) 11 18 50 s note 2: the output current is given by ns np rcs eq vcs i out = ,
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 6 typical performance characteristics figure 4. operating current vs. supply voltage figure 5. source current vs. supply voltage 10 15 20 25 30 100 200 300 400 500 600 700 800 operating current ( a) supply voltage (v) 10 15 20 25 30 20 25 30 35 40 source current (ma) supply voltage (v) figure 6. minimal operating voltage vs. ambient temperature -40 -20 0 20 40 60 80 100 120 140 2.0 2.5 3.0 3.5 4.0 4.5 5.0 minimal operating voltage (v) ambient temperature ( o c) figure 7. operating current vs. ambient temperature -40-20 0 20406080100120140 300 350 400 450 500 operating current ( a) ambient temperature ( o c)
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 7 typical performance characteristics (continued) figure 10. fb input resistance vs. ambient temperature figure 11. source current vs. ambient temperature figure 8. start-up current vs. ambient temperature figure 9. start-up voltage vs. ambient temperature -40 -20 0 20 40 60 80 100 120 140 13 14 15 16 17 18 start-up voltage (v) ambient temperature ( o c) -40 -20 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 3.0 start-up current ( a) ambient temperature ( o c ) -40 -20 0 20 40 60 80 100 120 140 1.00 1.25 1.50 1.75 2.00 ambient temperature ( o c ) fb input resistance (m ) -40 -20 0 20 40 60 80 100 120 140 10 15 20 25 30 35 40 45 50 source current (ma) ambient temperature ( o c )
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 8 typical performance characteristics (continued) figure 13. primary side maximum on time vs. ambient temperature figure 14. leb vs. ambient temperature figure 12. current sense voltage vs. ambient temperature -40 -20 0 20 40 60 80 100 120 140 300 350 400 450 500 550 600 current sense voltage (mv) ambient temperature ( o c) -40 -20 0 20 40 60 80 100 120 140 0 10 20 30 40 primary side maximum on time ( s) ambient temperature ( o c ) -40 -20 0 20 40 60 80 100 120 140 300 350 400 450 500 550 600 650 700 750 800 ambient temperature ( o c ) leb (ns)
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 9 typical application + c1 + c4 v o + v o - d2 r1 rs q1 r6 r7 t1 d1 c2 vcc out fb cs gnd ap1686 ns na np + r2 r line r10 1 3 4 6 2,5 figure 15. typical led driver application
preliminary datasheet low-power off-line ps r led controller ap1686 nov. 2012 rev. 1.1 bc d semiconductor manuf acturing limited 10 mechanical dimensions sot-23-6 unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 mark
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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